Dimethylamine borane (DMAB) is a reducing agent that can reduce the CuO layer to Cu₂O in the black oxide process of printed circuit boards(PCB), preventing the formation of "pink rings" during acid treatment. Additionally, it serves as a reducing agent in electroless plating, enabling the deposition of metals such as cobalt, molybdenum, silver, gold, and zinc. DMAB is a mild reducing agent, it could react with organic functionalities such as aldehydes, ketones…etc.