A flame retardant substance that resists combustion or decomposes under heat through endothermic reactions. It is halogen-free with excellent compatibility with resins. Commonly added to epoxy resins for applications in copper-clad laminates, circuit boards, and electronic equipment plastics.

Specification

Articles Characteristics Applications
DOPO
  • CAS NO.:35948-25-5
  • White crystalline powder or flakes.
  • Chemical formula:C12H9O2P
  • Assay(%):≧99
  • Melting point:116~119℃
  • Flash Point:225℃
  • PH:Weakly acidic in aqueous solution
  • Suitable for epoxy resins, particularly for applications in copper foil substrates, printed circuit boards, and plastics for electronic devices.

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